UNITED
STATES
SECURITIES
AND EXCHANGE COMMISSION
Washington,
D.C. 20549
FORM 6-K
REPORT
OF FOREIGN PRIVATE ISSUER PURSUANT TO RULE 13a-16 OR 15d-16 UNDER THE SECURITIES EXCHANGE ACT OF 1934
For the month
of July, 2025
Commission
File Number: 1-13546
STMicroelectronics N.V.
(Name
of Registrant)
WTC Schiphol Airport
Schiphol Boulevard 265
1118 BH Schiphol Airport
The Netherlands
(Address
of Principal Executive Offices)
Indicate by check mark whether the registrant
files or will file annual reports under cover of Form 20-F or Form 40-F:
Form 20-F ☒ Form 40-F
☐
Enclosure: A press release dated July
24, 2025, announcing STMicroelectronics’ acquisition of NXP’s MEMS sensors business.

PR N°C3350C
STMicroelectronics to strengthen position in sensors
with acquisition of NXP’s MEMS sensors business
| · | ST enters into agreement for acquisition of NXP’s MEMS sensor business
for a purchase price of up to US$950 million in cash, including US$900 million upfront and US$50 million subject to the achievement of
technical milestones |
| · | The MEMS businesses of ST and NXP are strongly complementary in terms of
technology and product portfolio, with the combined product offering to be well balanced across automotive, industrial and consumer end
markets |
| · | NXP’s MEMS Business generated revenue of about US$300 million in
calendar year 2024 with gross and operating margins significantly accretive for ST |
| · | All-cash transaction to be financed from existing liquidity and expected
to be accretive to ST Earnings Per Share from completion |
Geneva, Switzerland, July 24, 2025 -- STMicroelectronics (NYSE: STM), a
global semiconductor leader serving customers across the spectrum of electronics applications, is strengthening its global sensors capabilities
with the planned acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business, focused on automotive safety products
as well as sensors for industrial applications. The transaction will complement and expand ST’s leading MEMS sensors technology
and product portfolio, unlocking new opportunities for development across automotive, industrial and consumer applications.
“The planned acquisition is a great strategic fit for ST,”
says Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group of STMicroelectronics. “Together with ST’s
existing MEMS portfolio, these highly complementary technologies and customer relationships, focused on automotive safety and industrial
technologies, will strengthen our position in sensors across key segments in automotive, industrial and consumer applications. By leveraging
our IDM model, with technology R&D, product design and advanced manufacturing, we will better serve all our customers worldwide.”
“NXP is a leading supplier of automotive MEMS based motion and
pressure sensors, with a long history of strong customer adoption,” said Jens Hinrichsen, Executive Vice President and General
Manager, Analog and Automotive Embedded Systems of NXP. “However, after careful portfolio review the company has decided the
business does not fit into its long-term strategic direction. We have agreed with STMicroelectronics that the product line will fit ideally
into ST’s portfolio, manufacturing footprint and strategic roadmap. We are gratified that the MEMS sensor team will have an excellent
home and long-term future at ST.”
The MEMS sensors portfolio to be acquired by ST primarily targets automotive
safety sensors, both passive (airbags) and active (vehicle dynamics), as well as monitoring sensors (TPMS1,
engine management, convenience, and security). It also includes pressure sensors and accelerometers for industrial applications. ST is
well-positioned to leverage strong, established customer relationships with automotive Tier1s with its innovation roadmap in a rapidly
expanding MEMS automotive market. MEMS technologies increasingly enable advanced functionalities for safety, electrification, automation,
and connected vehicles, paving the way for future revenue growth.
1 Tire Pressure
Monitoring Systems.
MEMS inertial sensors in Automotive are expected to grow at a faster pace
than the broader MEMS market. The business to be acquired generated about 300m$ revenues in 2024 with gross and operating margin both
significantly accretive for ST. It is also expected to be accretive to ST Earnings Per Share from completion.
The planned acquisition will enhance ST’s MEMS technology, product
R&D capabilities and roadmap, with leading IP, technology and products for automotive safety applications and highly skilled R&D
teams. The expanded business will take advantage of ST’s Integrated Device Manufacturer model for MEMS, which involves every stage
of MEMS development, from design and manufacturing to testing and packaging, enabling faster innovation cycles and greater flexibility
for customization.
STMicroelectronics and NXP have entered into a definitive transaction agreement
for a purchase price of up to US$950 million in cash, including US$900 million upfront and US$50 million subject to the achievement of
technical milestones. The transaction which will be financed with existing liquidity is subject to customary closing conditions, including
regulatory approvals, and is expected to close in H1 2026.
Forward-looking Information
Some of the statements contained in this release that are not historical
facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities
Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views
and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results,
performance or events to differ materially from those anticipated by such statements due to, among other factors:
| • | changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic
environment and may directly or indirectly adversely impact the demand for our products; |
| • | uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production
capacity and end-market demand for our products; |
| • | customer demand that differs from projections which may require us to undertake transformation measures that may not be successful
in realizing the expected benefits in full or at all; |
| • | the ability to design, manufacture and sell innovative products in a rapidly changing technological environment; |
| • | changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers,
or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest,
labor actions, or terrorist activities; |
| • | unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D
and manufacturing programs, which benefit from public funding; |
| • | financial difficulties with any of our major distributors or significant curtailment of purchases by key customers; |
| • | the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity
reserved with suppliers or third-party manufacturing providers; |
| • | availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies
required by our operations (including increasing costs resulting from inflation); |
| • | the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical
operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers,
partners and providers of third-party licensed technology; |
| • | theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation;
|
| • | the impact of IP claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms
and conditions; |
| • | changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits
or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax
credits, benefits, deductions and provisions and to realize deferred tax assets; |
| • | variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the
other major currencies we use for our operations; |
| • | the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant; |
| • | product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or
recalls by our customers for products containing our parts; |
| • | natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate
change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate; |
| • | increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and
our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and
employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027; |
| • | epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time,
and could also materially adversely affect our business and operating results; |
| • | industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; |
| • | the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability
of critical third-party components and performance of subcontractors in line with our expectations; and |
| • | individual customer use of certain products, which may differ from the anticipated uses of such products and result in differences
in performance, including energy consumption, may lead to a failure to achieve our disclosed emission-reduction goals, adverse legal action
or additional research costs. |
Such forward-looking statements are subject to various risks and uncertainties,
which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements.
Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”,
“may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates”
or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans
or intentions.
Some of these risk factors are set forth and are discussed in more detail
in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31,
2024 as filed with the Securities and Exchange Commission (“SEC”) on February 27, 2025. Should one or more of these risks
or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described
in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry
information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.
Unfavorable changes in the above or other factors listed under “Item
3. Key Information — Risk Factors” from time to time in our Securities and Exchange Commission (“SEC”) filings,
could have a material adverse effect on our business and/or financial condition.
About STMicroelectronics
At ST, we are 50,000 creators and makers of semiconductor technologies mastering
the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than
200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and
opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy
management, and the wide-scale deployment of cloud connected autonomous things. We are on track to be carbon neutral in all direct and
indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and
to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.
For further information, please contact:
INVESTOR RELATIONS
Jérôme Ramel
EVP Corporate Development & Integrated External Communication
Tel: +41.22.929.59.20
[email protected]
MEDIA RELATIONS
Alexis Breton
Group VP Corporate External Communications
Tel: +33.6.59.16.79.08
[email protected]
SIGNATURES
Pursuant to the requirements
of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto
duly authorized.
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STMicroelectronics N.V. |
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Date: |
July 25, 2025 |
By: |
/s/ Lorenzo Grandi |
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Name: |
Lorenzo Grandi |
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Title: |
President and Chief Financial Officer
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