SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation
SK hynix (HXSCL) has pioneered the industry's first mobile DRAM with enhanced heat dissipation capabilities by implementing High-K Epoxy Molding Compound (EMC) technology. The innovation improves thermal conductivity by 3.5 times and reduces thermal resistance by 47% compared to traditional solutions.
The breakthrough addresses critical heat management challenges in smartphones running on-device AI applications, particularly in flagship models using Package on Package (PoP) architecture. By adding Alumina to existing Silica-based EMC material, SK hynix has created a solution that promises to extend battery life and device longevity while maintaining optimal performance.
SK hynix (HXSCL) ha realizzato il primo DRAM mobile del settore con capacit脿 di dissipazione termica potenziate, grazie all'impiego della tecnologia High-K Epoxy Molding Compound (EMC). L'innovazione aumenta la conducibilit脿 termica di 3,5 volte e riduce la resistenza termica del 47% rispetto alle soluzioni tradizionali.
Questa svolta risolve problemi critici di gestione del calore negli smartphone che eseguono applicazioni AI direttamente sul dispositivo, in particolare nei modelli top di gamma con architettura Package on Package (PoP). Aggiungendo l'allumina al materiale EMC a base di silice gi脿 esistente, SK hynix ha sviluppato una soluzione che promette di prolungare la durata della batteria e del dispositivo mantenendo prestazioni ottimali.
SK hynix (HXSCL) ha desarrollado el primer DRAM m贸vil del sector con mayor disipaci贸n t茅rmica, mediante la tecnolog铆a High-K Epoxy Molding Compound (EMC). La innovaci贸n mejora la conductividad t茅rmica 3,5 veces y reduce la resistencia t茅rmica en un 47% frente a las soluciones tradicionales.
Este avance aborda desaf铆os cr铆ticos de gesti贸n del calor en smartphones que ejecutan aplicaciones de IA en el dispositivo, especialmente en modelos de gama alta con arquitectura Package on Package (PoP). Al a帽adir al煤mina al material EMC a base de s铆lice ya existente, SK hynix ha creado una soluci贸n que promete aumentar la duraci贸n de la bater铆a y la vida 煤til del dispositivo sin sacrificar el rendimiento.
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鞚措矆 靹标臣電� 韸鬼瀳 韺偆歆� 鞓� 韺偆歆�(PoP) 甑“毳� 靷毄頃橂姅 頂岆灅攴胳嫮 氇嵏 霌� 霐旊皵鞚挫姢 雮� AI 鞎犿攲毽紑鞚挫厴 鞁ろ枆鞙茧 鞚疙暅 頃奠嫭 鞐� 甏�毽� 氍胳牅毳� 頃搓舶頃╇媹雼�. 旮办〈 鞁るΜ旃� 旮半皹 EMC鞐� 鞎岆（氙鸽倶毳� 於旉皜頃溂搿滌崹 SK hynix電� 氚绊劙毽� 靾橂獏瓿� 旮瓣赴 雮搓惮靹膘潉 鞐办灔頃橂┐靹� 斓滌爜鞚� 靹彪姤鞚� 鞙犾頃橂姅 靻旊（靺橃潉 毵岆摛鞐堨姷雼堧嫟.
SK hynix (HXSCL) a mis au point le premier DRAM mobile du secteur dot茅 d'une dissipation thermique am茅lior茅e en utilisant la technologie High-K Epoxy Molding Compound (EMC). Cette innovation am茅liore la conductivit茅 thermique de 3,5 fois et r茅duit la r茅sistance thermique de 47% par rapport aux solutions traditionnelles.
Cette avanc茅e r茅pond aux d茅fis cruciaux de gestion thermique des smartphones ex茅cutant des applications d'IA sur l'appareil, notamment sur les mod猫les haut de gamme utilisant l'architecture Package on Package (PoP). En ajoutant de l'alumine au mat茅riau EMC 脿 base de silice existant, SK hynix a cr茅茅 une solution qui promet d'allonger l'autonomie de la batterie et la dur茅e de vie de l'appareil tout en maintenant des performances optimales.
SK hynix (HXSCL) hat den ersten mobilen DRAM der Branche mit verbesserter W盲rmeableitung entwickelt, indem High-K Epoxy Molding Compound (EMC)-Technologie eingesetzt wurde. Die Innovation erh枚ht die W盲rmeleitf盲higkeit um das 3,5-Fache und reduziert den thermischen Widerstand um 47% gegen眉ber herk枚mmlichen L枚sungen.
Dieser Durchbruch behebt kritische W盲rme颅management颅probleme in Smartphones, die KI-Anwendungen direkt auf dem Ger盲t ausf眉hren, insbesondere bei Flaggschiff-Modellen mit Package-on-Package-(PoP)-Architektur. Durch die Zugabe von Aluminiumoxid zum bestehenden silica-basierten EMC-Material hat SK hynix eine L枚sung geschaffen, die die Batterielaufzeit und die Lebensdauer des Ger盲ts verl盲ngern soll, ohne die Leistung zu beeintr盲chtigen.
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- Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by
47% - Customers expect achievement to help address heat issue generated from on-device AI
- SK hynix to lead next-generation DRAM for mobile device through technological innovation of materials
* EMC(Epoxy Molding Compound): a critical material for semiconductor packaging that protects chips from various external conditions such as water, heat, impact and electronic charge and provides a channel where heat can be dissipated. High-K EMC raises thermal conductivity with adoption of a material with high heat-transfer coefficient in EMC |
The development comes as heat generated in the process of fast data transfer for on-device AI applications results in performance degradation of smartphones. Global smartphone companies welcome the launch of the product on expectations that it will help address the heat issue of high-performance flagship smartphones.
The structure of package on package, or PoP**, that most flagship smartphones adopt and stacks DRAM onto the application processor***, allows efficient use of limited space, while improving data transfer speed. Such system, however, also triggers a performance degradation of the device itself as heat generated within the mobile AP stays inside DRAM.
** PoP(Package on Package): a packaging method commonly used for mobile products. Different types of chips are stacked vertically to improve space efficiency, performance and flexibility of combinations |
*** Mobile AP(Application Processor): chip referred to the brain of mobile devices such as smartphones and tablets |
SK hynix found the solution in improvement of thermal conductivity of EMC, a critical material that covers DRAM package and developed High-K EMC by adding Alumina to Silica, which has been adopted for EMC material so far.
With thermal conductivity improved by 3.5 times and thermal resistance in the vertical course of the heat improved by
"It's a meaningful achievement that goes beyond a simple performance improvement as it addresses the inconvenience that many high-performance smartphone users may have had," Lee Gyujei, Head of Package Product Development, said. "We are committed to firmly establishing our technological leadership in the next-generation mobile DRAM market with our technological innovation in materials."
About SK hynix Inc.
SK hynix Inc., headquartered in
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SOURCE SK hynix Inc.
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